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Reliability and Failure of Electronic Materials and ~ Reliability and Failure of Electronic Materials and Devices is a wellestablished and wellregarded reference work offering unique singlesource coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging With a focus on statistically predicting failure and product yields this book can help the design engineer manufacturing engineer and quality control engineer all better understand the common mechanisms that

Reliability and Failure of Electronic Materials and Devices ~ Reliability and Failure of Electronic Materials and Devices integrates a treatment of chip and packaging level failures within the context of the atomic mechanisms and models used to explain degradation and the statistical handling of lifetime data Electromigration dielectric radiation damage and the mechanical failure of contacts and solder joints are among the failure mechanisms considered

Reliability and Failure of Electronic Materials and Devices ~ Reliability and Failure of Electronic Materials and Devices is a wellestablished and wellregarded reference work offering unique singlesource coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging With a focus on statistically predicting failure and product yields this book can help the design engineer manufacturing engineer and quality control engineer all better understand the common mechanisms that

Reliability and Failure of Electronic Materials and ~ Reliability and Failure of Electronic Materials and Devices is a wellestablished and wellregarded reference work offering unique singlesource coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging With a focus on statistically predicting failure and product yields this book can help the design engineer manufacturing engineer and quality control engineer all better understand the common mechanisms that

Reliability and Failure of Electronic Materials and ~ Reliability and Failure of Electronic Materials and Devices integrates a treatment of chip and packaging level failures within the context of the atomic mechanisms and models used to explain degradation and the statistical handling of lifetime data Electromigration dielectric radiation damage and the mechanical failure of contacts and solder joints are among the failure mechanisms considered

Reliability and Failure of Electronic Materials and Devices ~ Milton Ohring in 1 offers a complete coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics pack aging With a focus on

Reliability and Failure of Electronic Materials and Devices ~ Reliability and Failure of Electronic Materials and Devices integrates a treatment of chip and packaging level failures within the context of the atomic mechanisms and models used to explain degradation and the statistical handling of lifetime data

Reliability and Failure of Electronic Materials and Devices ~ Reliability and Failure of Electronic Materials and Devices integrates a treatment of chip and packaging level failures within the context of the atomic mechanisms and models used to explain degradation and the statistical handling of lifetime data Electromigration dielectric radiation damage and the mechanical failure of contacts and solder joints are among the failure mechanisms considered

Reliability and Failure of Electronic Materials and ~ Covers all major types of electronics materials degradation and their causes including dielectric breakdown hotelectron effects electrostatic discharge corrosion and failure of contacts and solder jointsNew updated sections on failure physics on mass transportinduced failure in Cu and lowk dielectrics and on reliability of leadfreereducedlead solder chapter on testing procedures sample handling and sample selection and experimental e of new